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It will be one of the products featured at Robatech’s PACK EXPO Connects virtual booth.
With up to 800 switching cycles/sec, it enables very small bead and dot application for particularly demanding and clean gluing applications at high production speeds.
Robatech’s SpeedStar Compact hot-melt adhesive application head it enables very small bead and dot application for particularly demanding and clean gluing applications at high production speeds.
It integrated an automatic stroke adjustment to ensure that the electromechanical jetting head can maintain the precision in adhesive application over the entire service life of approx. 500 million operating cycles. Manual readjustments are no longer necessary, and maintenance-related interruptions are reduced.
However, SpeedStar Compact has a lot more to offer. Compared to its predecessor SpeedStar Diamond, the new electric head has been technically optimized in terms of hardware and is, therefore, more durable. As the electronic unit is detached from the head, SpeedStar Compact is also 46 mm smaller. With the new design, Robatech considers the limited space available in the industry. Space-saving integration into systems and entire machines becomes possible for the customers. The higher protection class IP55 allows better use in wet areas.
PACK EXPO Connects–November 9-13. Now more than ever, packaging and processing professionals need solutions for a rapidly changing world, and the power of the PACK EXPO brand delivers the decision makers you need to reach. Attendee registration is open now.
