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High-speed MAP packaging increases labor efficiency

M-Tek, a leader in Modified Atmosphere Packaging will be exhibiting our latest labor saving MAP packaging system in booth N-5877.

The Corr-Vac Mark-III HSP allows one operator to run three Mark-III’s. Controlled by a state-of-the-art B&R PowerPanel 500 allowing machine configurations to be backed up with a USB. This unit also includes optional Wi-Fi allowing full interface and control diagnostics online using a smartphone or tablet. The Mark-III HSP automatically cycles in cases, positions them for gas-flush & sealing greatly enhancing plant productivity.

Visit M-Tek at booth# 5877 in the North Hall at PACK EXPO.

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Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
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Discover How to Stay Ahead of the Competition at PACK EXPO International