See What’s Possible in Packaging & Processing @ PACK EXPO International
See packaging & processing solutions from 2,600 exhibitors and gain insights from 150+ free educational sessions at PACK EXPO International.
REGISTER NOW & SAVE

Create a free Packaging World account to continue reading

CLEMSON HOSTS EXTENSION SEMINARS

Clemson University will host “Packaging Fundamentals,” Nov. 4-6, and “Managing Packaging Development,” Nov. 6-7. The former seminar will cover packaging materials, laws, regulations, testing, and environmental issues.

The latter will cover a systematic and integrated packaging development approach, involving production, marketing, packaging engineering, packaging suppliers, sales, and purchasing. Details are available at www.clemson.edu/pkgsci, or by calling Dr. Scott Whiteside at 864/656-6246.

Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
REGISTER NOW & SAVE
Discover How to Stay Ahead of the Competition at PACK EXPO International
Is your packaging line built for connected packaging?
RFID, QR codes, and 2D barcodes are reshaping CPG operations. See how leading brands are adapting.
Read More
Is your packaging line built for connected packaging?