See What’s Possible in Packaging & Processing @ PACK EXPO International
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Efficient thermoforming operation with an easy-to-use HMI

Multivac’s R 235 thermoforming packaging machine is specially tailored to produce flat packs of sliced products. The machine is powered by a Beckhoff control platform­­––bringing together EtherCAT technology for the controller, servos and I/O. One operator terminal houses the HMI, which uses custom Java on top of the Beckhoff controller.

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Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
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Discover How to Stay Ahead of the Competition at PACK EXPO International