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Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Pack Solutions Challenge Winners Announced

The Rutgers University team – Marie Misterio, Diana Mayorga, Miles Borgeson, Diana Jones — took first place in the 2013 PACK Solutions Challenge, and will share a $4,000 scholarship from the PMMI Education and Training Foundation. Marc Ostertag, president of contest sponsor B&R Industrial Automation, made the presentation in a brief awards presentation this afternoon.

Six packaging programs participated in this year’s competition: Cal Poly State University, Clemson University, Purdue University Calumet, Rutgers University, University of Florida and Virginia Tech.

Purdue Calumet’s team (Armando Cabrera, Jr., Florin Mustata, Aminov Parvizsho and Thaddeus Wleklinski) earned second place in the contest, a $2,000 scholarship to share; and third place went to Clemson’s team of Richard George, Raj Navalakha, Colin Mitchell and Mackenzie Lussier. The Clemson team will share $1,000.

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers