The new version of Pentapharm BlisterPro will further expedite the package development cycle by combining BlisterPro finite element analysis simulations with actual tool design, fabrication, and package production. The next generation BlisterPro capabilities are supported by a new state-of-the-art blister packaging machine and an in-house CNC (computer numerical control) machine allowing for rapid prototype package sample production. Designs are created, analyzed, and optimized by the BlisterPro software solution and the exact final design is directly transmitted to the CNC machine for tool fabrication.
In addition, there are the added capabilities of rapid response to sample requirements; modeling and production of multiple cavity designs on a single tool for comparative analysis and testing; and evaluation of stability packaging components by analyzing the differences between stability and production tools including proper safety margins to account for differences among machinery and mold combinations.