See new packaging innovations in one convenient place at PACK EXPO East
Get up to speed on the latest innovations in packaging and processing at PACK EXPO East, March 18 – 20 in Philadelphia. Don’t miss out!

Allied Electronics & Automation signs distribution agreement with Teledyne Microwave Solutions

Allied Electronics & Automation signed a distribution agreement with Teledyne Microwave Solutions (TMS) to begin distributing TMS commercial products designed for aerospace, defense, and industrial applications.

Allied is excited to expand our partnership with Teledyne with the addition of Teledyne Microwave Solutions,” said Product Director Marie Dawson. “We will operate as a limited-distribution partner in North America for this new offering.”

“Over the years, Teledyne Microwave Solutions has established a strong reputation and footprint in the microwave and RF marketplace,” said Greg Silva, Senior Program Manager for Teledyne Microwave. “We are thrilled to enter into this new partnership with Allied, whose strong brand resonates with our customer base. With Allied, we are certain that our key product lines and capabilities will find real traction with its strong distribution network.”

Discover Our Content Hub
Access Packaging World's free educational content library!
Read More
Discover Our Content Hub
Discover innovations from 400+ packaging & processing suppliers.
The largest PACK EXPO East in history is March 18-20 in Philadelphia! In one convenient location, you’ll discover new technology from top suppliers, get quality problem-solving time with experts and learn the latest trends in free educational sessions.
Read More
Discover innovations from 400+ packaging & processing suppliers.