Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

TURCK, Inc: Single axis MEMS inclinometer sensor

TURCK's single axis inclinometer sensor solves unique feedback requirements for applications such as leveling platforms, controlling a dancer or controlling tilt angle in a diverse array of industries.

Turck_inclinometer
Turck_inclinometer

The sensor detects angular tilt throughout full 360 degree range in reference to gravity. The device consists of two parallel plate electrodes, one stationary and one attached to a spring-mass system. The inclinometer's MEMS technology utilizes a microboard design that helps ensure high accuracy within a compact, industrialized package. IP68-rated and offers a wide temperature range of -30 to 70° C.

Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
REGISTER NOW & SAVE
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Annual Outlook Report: Sustainability
The road ahead for CPGs in 2025 and beyond—Packaging World editors review key findings from a survey of 88 brand owners, CPG, and FMCG readers.
Download Now
Annual Outlook Report: Sustainability