Italy's OMET partners with Clemson's Packaging Institute

The goal is to break new ground in the emerging market of printed electronics. "Packaging is a $200 billion plus business in the United States, and Clemson has invested in this business knowledge base,” says Chip Tonkin, director of the institute. “In a collaborative effort, Clemson will conduct a holistic approach to packaging sciences, combining many academic disciplines, to learn how to best create packaging.”

OMET has donated a new Varyflex press to Clemson. The press will be used by students for R&D, industry activities and for OMET customer demonstrations. “We are pleased to be part of this ground breaking research," stated Marco Calcagni, director of sales for OMET. "Clemson is a worthy partner and we are extremely pleased that our VaryFlex press can further the knowledge in this emerging field.”

The narrow web press features seven printing stations that can be configured with rotary screen, flexography or gravure with a variety of solvent based, water based and UV curable ink systems. The press platform can handle polymer substrates as thin as 12 microns, or paperboard materials as thick as 600 microns, while achieving high-end registration through a servo controlled system.