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Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

Void-fill system upgrade

Hp 18997 Aps
• a new engineering upgrade replaces the cutting-knife system that void-fill air-pillow systems use to slit the film prior to filling each pillow with air

• new vertical perforating process allows Express 3™ void-fill system to run without a knife, extending the time between maintenance cycles

• available for units currently installed, with new systems now coming standard with the Express 3 systems

Automated Packaging Systems
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
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Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
The AI revolution in packaging robotics is here
Robots that see variations, adjust grip pressure automatically, accept plain-English commands, and predict their own maintenance. Discover how AI is transforming packaging operations.
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The AI revolution in packaging robotics is here