Rockwell Automation to present innovative solutions at PACK EXPO International 2016

PACK EXPO's innovation stage offers many free education opportunities

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Rockwell Automation subject matter experts will be among the industry leaders providing free educational programming addressing top-of-mind challenges and trends on the Innovation Stage at PACK EXPO International. Located in Booth N-4570, Rockwell Automation presentations will focus on track and trace, remote monitoring and smart machines.

Deliver Valuable Genealogy/Track-and-Trace Information for Improved Production Control, Accountability, Safety and Economic Value
Sunday, Nov. 6, 3–3:30 p.m.
Manufacturers need to respond quickly to product-quality issues, but faster product introductions and global competition can complicate that goal. Craig Winterland, business development manager for Global Solutions at Rockwell Automation, will discuss how applications focused on delivering valuable genealogy and track-and-trace information can help companies improve production control, accountability, safety and economic value.

Remote Monitoring
Monday, Nov. 7, 1–1:30 p.m.
Machine builders are leveraging cloud technology and the internet of things to differentiate their offering and to improve the performance of their machines. This interactive session, presented by Axel Rodriguez, product manager at Rockwell Automation, will include a live connection to several machines, showing a secure system that empowers OEMs to remotely analyze and optimize the performance of their assets.

Building a Smarter Machine
Tuesday, Nov. 8, 10–10:30 a.m.
As end users pursue smart manufacturing, they need OEM partners to create smart machines and equipment that easily integrate into a facility, provide access to information, and enable agile reactions to changing market demands. Steve Mulder,regional segment manager for packaging at Rockwell Automation, will discuss how leading machine and equipment builders are capitalizing on this opportunity.

To learn more about Rockwell Automation participation at PACK EXPO International, please click here.


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