See What’s Possible in Packaging & Processing @ PACK EXPO International
See packaging & processing solutions from 2,600 exhibitors and gain insights from 150+ free educational sessions at PACK EXPO International.
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SIG Combibloc Inc. (Columbus, OH): Terry V. Derrico, president, CEO. Gulf States Paper Corp. (Tuscaloosa, AL): Michael E.

Case, president, CEO. PCI Services (Philadelphia, PA): Alan Waterhouse, president. Pneumatic Scale (Cuyahoga Falls, OH): Bill Morgan, president. Milacron (Cincinnati, OH): William J. Gruber, president, Ferromatic Milacron North America. Dover Industries (Apex, NC): David Pierce, president, Tipper Tie Inc. Sussez Technology (Radnor, PA): Thomas M. Michaels, president. Paperloop.com (San Francisco, CA): Raymond W. Yue, vp, finance and business planning. Pepsi-Cola (Purchase, NY): Steve Wienick, vp, worldwide research and development. Hewlett-Packard Co. (Palo Alto, CA): Alison Kent, managing dir., packaging process. Sidel (La Havre, France): Albert Journo, CEO. Leading Edge Packaging, Inc. (Arvada, CO): Gene Bourque, CEO, part-time CFO. Packtion (Chicago, IL): Edward A. Lapekas, executive chairman. Huhtamaki (Desoto, KS): "Bud" Philbrook, exec. vp. Mead (Dayton, OH): Ian W. Millar, executive vp., replacing Elias M. Karter, who retired; Mark T. Watkins, vp, technology. Nordson (Duluth, GA): John J. Keane, vp, packaging and product assembly business. Ampacet Corp. (Tarrytown, NY): Robert Fielding, vp, gen. mgr., U.S. operations. Maxcess Intl. Corp. (Fenton, MO): Marcel Hage, vp, sales, marketing. Nadel Industries (Port Chester, NY): Richard R. Mulburn, vp, operations. Marq Packaging (Yakima, WA): Jacob Schaffer, vp, mfg.; G.W. Walker, mgr., eng. GretagMacbeth, LLC (New Windsor, NY): Dr. Robert McMahan, vp, research and development. PolyOne Corp. (Cleveland, OH): Bernard Baert, vp, intl. operations. Axon Corp. (Raleigh, NC): Randy Victor, dir., sales, Styrotech. Motoman, Inc. (Dayton, OH): Carl Traynor, dir., marketing. Creative Packaging Corp. (Buffalo Grove, IL): Jeff Toth, dir., marketing. Heat and Control (Hayward, CA): Jeffrey Almond, mgr., snack food industry, Packaging Systems Div.

Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
REGISTER NOW & SAVE
Discover How to Stay Ahead of the Competition at PACK EXPO International
Is your packaging line built for connected packaging?
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Is your packaging line built for connected packaging?