Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.

I/O System

The Lumberg LioN-Power System consists of the LioN-Power Active IP67 I/O modules, the M12 Power Connector and the M8 5-pole B-coded cordsets.

Pfw 1262 1512np Belden2

The multiprotocol, compact I/O modules deliver flexibility and convenient installation in the field for Industrial Internet of Things (IIoT) applications. They meet EtherNet/IP and PROFINET protocol specifications and detect both input and output data directly in the machine, and provide an all-in-one product solution for robotics, machine handling, manufacturing, food and beverage, packaging, and automotive applications. The new power connector offers the ability of using cables from 1.5 to 2.5 mm² to transmit at high power levels for long periods of time. Taking advantage of new technology, the connector works well in high temperatures with a best-in-class derating. The matching cordsets feature an extended power range and snap and snap/thread attachment to ensure high performance reliability and make installation in the field easy. Together, these products create a one-stop solution for meeting the demanding industrial connectivity requirements brought on by the Industrial Internet of Things (IIoT).

Conveying Innovations Report
Editors report on distinguishing characteristics that define each new product and collected video demonstrating the equipment or materials as displayed at the show. This topical report, winnowed from nearly 300 PACK EXPO collective booth visits, represents a categorized, organized account of individual items that were selected based on whether they were deemed to be both new, and truly innovative, based on decades of combined editorial experience in experiencing and evaluating PACK EXPO products.
Take me there
Conveying Innovations Report
Coding, Marking, and Labeling Innovations Report
Explore our editor-curated report featuring cutting-edge coding, labeling, and RFID innovations from PACK EXPO 2024. Discover high-speed digital printing, sustainable label materials, automated labeling systems, and advanced traceability solutions that are transforming packaging operations across industries.
Access Report
Coding, Marking, and Labeling Innovations Report