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RND Automation will showcase its expanding packaging-equipment portfolio and broader automation capabilities at PACK EXPO International 2026, October 18–21, at McCormick Place in Chicago. Attendees can visit RND in Booth N-5115 in the North Hall.
The 2026 exhibit will highlight RND's approach to packaging automation: begin with proven, repeatable equipment platforms, configure them to meet the application's requirements, and integrate additional automation where the production process demands it.
Live KANGA Pouching Demonstration
At the center of the booth experience, RND's KANGA Poucher will run live throughout the show. Visitors will be able to see the vertical pouching process firsthand and package a multitool to take with them as a finished piece.
The demonstration is intended to show how a repeatable packaging platform can provide a reliable starting point while retaining flexibility for different products, package requirements, and production applications. The packaging web used for the demonstration will be supplied by Amcor.
Packaging Equipment for a Range of Applications
In addition to KANGA, RND will highlight packaging solutions for bagging and pouching, horizontal flexible packaging, tray packaging, sealing, and package-integrity testing.
RND's packaging portfolio includes MiniPack, MicroPack, TrayPack, Rotary Sealers, and QuickPouch by RND Automation.
RND designs and builds new QuickPouch Vertical, Horizontal, Mini, and Micro systems while also supporting the existing QuickPouch installed base with service, technical support, training, and genuine replacement parts.
The booth will also feature an RND SureVac leak-testing system. SureVac systems are designed to support package-quality programs by helping detect gross leaks in blister packs, pouches, medical-device packaging, and other sealed packages.
Testing Challenging Applications Before Production
A second major feature of the exhibit will be RND's High-Risk Test Bench, a configurable research, development and application-testing platform used by RND engineers to evaluate challenging automation tasks before they are incorporated into a complete production system.
The Test Bench allows RND to evaluate application variables such as robotics, gripping, motion, machine safety, sensing, controls, product handling and package testing under realistic conditions.
By testing difficult elements earlier, RND can identify technical risk, evaluate competing approaches and make more informed engineering decisions before moving into full-scale implementation.
The PACK EXPO Test Bench will feature technology from automation suppliers including Doosan Robotics, OnRobot, B&R Industrial Automation, FANUC, Pilz, Banner Engineering and Festo. A QuickPouch Micro and RND SureVac Leak Tester will also be incorporated into the display.
Automation Beyond the Packaging Machine
RND's booth will also feature a large FANUC M-710 industrial robot. The robot will be displayed alongside application footage illustrating how RND is using this robot class in an actual customer automation system.
Together, the packaging equipment, Test Bench, and robotics display demonstrate RND's ability to address more than the stand-alone packaging machine. The company's capabilities extend into robotics, product feeding and handling, inspection and testing, controls, machine safety, motion, and production-line integration.
“Manufacturers don't always need a machine engineered from the ground up, but they do need equipment that fits the needs of their product and process,” said Brantley Turner, General Manager, RND Automation. “Our focus is to start with proven platforms and use the breadth of our automation experience to solve application specific challenges.”
Visit RND at PACK EXPO International 2026
Attendees can visit RND Automation at Booth N-5115 in the North Hall at McCormick Place in Chicago, October 18–21, 2026.
Visitors can see the KANGA Poucher operating live, explore RND's High-Risk Test Bench and packaging portfolio, view industrial robotics applications, discuss current packaging or automation projects with the RND team, and enter RND's PACK EXPO giveaway for a chance to win a Bambu Lab 3D printer.
