Show Daily Exclusive - Sponsored by Festo (Booth N-5147) and staffed by students and faculty from the Packaging Science program at Clemson University (Booth E-6644), this interactive exhibit explores emotional analytics studies and provides tips for leveraging data to develop award-winning packaging. This year’s edition builds on several years of Clemson research on packaging and its effects on people.
“Festo is proud to sponsor this exciting exhibit,” says Richard J. Huss, president, Festo US. He adds, “The virtual reality and eye-tracking demonstrations offer an immersive look at how packaging allows consumers to interact with brands using cutting-edge technology. We’re glad to be involved in connecting show attendees to the latest technological innovations and give Clemson students a platform like PACK EXPO International.”
The exhibit is a popular destination for show-goers. “Every year this exhibit really shows the talent and promise of the next-generation workforce. . . . we’re looking forward to what’s in store at their exhibit this year,” says Jim Pittas, president and CEO of PMMI, The Association for Packaging and Processing Technologies (Booth N-4550), the organizer of the PACK EXPO family of shows.
For more information, visit www.festo.com/us, www.sonocoinstitute.com/c/section/industry_services/eyetracking-lab/, www.PACKEXPOinternational.com. SD