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Markem-Imaje to Exhibit Print and Packaging Innovations at PACK EXPO Las Vegas

See it at PACK EXPO Las Vegas, Booth #C-1528! Markem-Imaje will exhibit its cross-sector print and packaging innovations.

Markem-Imaje’s newest innovation to be showcased in the U.S. market will be the Super Piezo Inkjet (SPI) marking technology that was designed to answer the demand of brands to have high quality print including serialized 2D codes, essential to the FSMA and the revolution coming to the market in dynamic barcodes from GS1. The technology will give brands the capability to mark their products with unique codes on 3D complex surfaces at very high speeds. 

Markem-Imaje will also demonstrate its latest state-of-the-art laser models, each responding to industry demands in the segment’s three technologies and helping to improve on ESG goals while boosting productivity. The company’s new ultraviolet technology, the UV500, excels on difficult materials where other laser technologies cannot perform so well, including on the finest, easily-damaged substrates like new more environmentally friendly thinner mono films, as well as polymer labels and thermoplastics like  HDP. 

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