Discover your next big idea at PACK EXPO Las Vegas
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries. Click to learn more.

Belden Inc: EtherNet/IP I/O modules

Belden’s Lumberg EtherNet/IP I/O modules fully support device level ring (DLR) protocol and line (daisy chain) topologies and are suitable for machine tool, material handling, filling and packaging machinery applications.

The modules facilitate the connection of discrete wiring devices (sensor/actuators) via 16 digital I/O channels with universal input/output or input functionality directly to industrial controllers.  They are available with 16 universal user-selectable digital inputs/outputs (0980 ESL 710) or 16 dedicated inputs (0980 ESL 711). The easy diagnostic concept helps to find the exact location of any faults for each I/O port with “on-board” LED diagnostic indicators.

Access to this information is also available via the EtherNet/IP network, making it possible to evaluate the details on a centralized operating and display system, such as an HMI, without having to configure the module.  Both modules fully support ODVA’s Device Level Ring (DLR) standard (Including Allen-Bradley® ControlLogix and Kinetix products), enabling multi-port EtherNet/IP devices to operate in a ring or linear topology. DLR insures that a single-point failure does not prevent communication between the remainder of the functioning devices. The integrated switch External switches are not needed, reducing costs.

Because of their rugged housing and IP67 terminations, these EtherNet/IP modules require no protective enclosure and are ideally suited for mounting directly on machines. Operational temperatures are -10°C to +60°C; and 24 V DC (11-30 V DC) power input is through standardized 7/8-in. 4-pole power connectors. Network addressing is via rotary switches, BOOTP or DHCP.


 

Annual Outlook Report: Sustainability
The road ahead for CPGs in 2025 and beyond—Packaging World editors review key findings from a survey of 88 brand owners, CPG, and FMCG readers.
Download Now
Annual Outlook Report: Sustainability
Annual Outlook Report: Automation & Robotics
What's in store for CPGs in 2025 and beyond? Packaging World editors explore the survey responses from 118 brand owners, CPG, and FMCG Packaging World readers for its new Annual Outlook Report.
Download
Annual Outlook Report: Automation & Robotics