Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

GE Fanuc Automation: Universal analog input module

GE Fanuc Automation has introduced the PACSystems™ RX3i Universal Analog Input module, which offers the functionality of 4 modules in 1, reducing I/O module space requirements, decreasing the number of spare parts and inventory, and simplifying wiring and configuration.

Pw 10654 C Ge Fanuc

Can be configured on a per channel basis for Thermocouple, Strain Gage, RTD, voltage, or current. Provides 20 different types of analog input configurations.

Is your palletizing solution leaving money on the floor?
Discover which palletizing technology—robotic, conventional, or hybrid—will maximize your packaging line efficiency while minimizing long-term costs in this comprehensive analysis.
Read More
Is your palletizing solution leaving money on the floor?
2024 PACK EXPO Innovations Reports
Exclusive access: Packaging World editor-curated reports revealing PACK EXPO's most groundbreaking technologies across food, healthcare, and machinery sectors. Each report features truly innovative solutions selected from hundreds of exhibitors by our expert team. Transform your operations with just one click.
Access Now
2024 PACK EXPO Innovations Reports