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Supplier News
Supplier News
The latest supplier news from Packaging World
Controls & Machine Components
Balluff: MAC valve mainifold control
Simplify valve manifold control using Distributed Modular I/O.
February 13, 2013
Blisters/clamshells/thermoforming materials
Desiccated blister packaging
Desiccated blister packaging protects moisture and oxygen-sensitive solid dose pharmaceuticals for better product performance.
February 13, 2013
Containers
One-way PET kegs
Lightweight Containers launched the first member of a new generation of KeyKegs: the cylindrical KeyKeg20.
February 13, 2013
Additives, coatings & inks
Ink development kit for Epson DX5 print head
A JetXpert-based ink development kit, specifically designed to address the unique characteristics of the Epson DX5 print head is now available.
February 13, 2013
Adhesives/tape
Optimizing hot melt adhesive use in packaging operations
With the increasing prices and decreasing availability of hot melt adhesives, packagers can no longer just place a long bead of adhesive to ensure a strong seal or bond. Packagers must determine the exact amount of adhesive needed to produce a secure bond, then follow up by implementing dispensing technologies that will preserve the integrity of their process and bottom lines. Recent tests prove that the bond strength of short intermittent adhesive beads is equal to the bond strength of long, continuous beads.
February 8, 2013
Thermoform/fill/seal
MG America: Thermoformer for single-use food packaging
MG America
Balcony-style machine designed for portion pack thermoforming, dosing, sealing and cutting.
February 8, 2013
Secondary Packaging
ITW Muller: Semi-automatic turntable stretch wrap machine
Muller LCS
ITW Muller introduces an enhancement to its Raptor Series of turntable machines with Raptor Plus™.
February 8, 2013
Conveying & accumulation
Flexicon Corporation: Automated bulk bag conditioner
Flexicon Corporation
A new BLOCK-BUSTER™ Bulk Bag Conditioner from Flexicon features a hydraulically-actuated, variable-height turntable for automated in-frame bag rotation and conditioning of bulk bags at varying heights.
February 8, 2013
Conveying & accumulation
Advance Lifts, Inc: Hot dip galvanized base frames
Advance Lifts, Inc.
Starting February 4th 2013, all Advance Lifts' T-series dock lifts will have hot dipped Galvanized base frames.
February 4, 2013
Filling/capping, dry
Bosch Packaging Technology: Capping machine
Syntegon
Bosch Packaging Technology developed a new sealing solution for injection and infusion vials: the compact VRT 1010|1020.
February 1, 2013
Coding, Printing & Labeling
B&H Labeling Systems: Glue extrusion system
B&H Labeling Systems
B & H Labeling Systems introduced the new B & H Glue Extrusion System.
February 1, 2013
Conveying & accumulation
Key Technology: Vibratory conveyors
Key Technology, Inc., a Duravant company
Key Technology introduced enhancements to its popular Iso-Flo® family of stainless steel vibratory conveyors.
February 1, 2013
Coding, Printing & Labeling
Cognex Corporation: Barcode readers feature new software
Cognex Corporation
Cognex Corporation integrated advanced 2DMax+™ code reading software technology into the compact DataMan® 100 and 200 fixed-mount barcode readers.
February 1, 2013
Controls & Machine Components
Wago Corporation: Push-button SMD-Terminal Block
WAGO Corporation’s 2060 Series push-button SMD-Terminal Block gains a 600V/9A 2-pole unit.
January 31, 2013
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Balluff: Color sensor
Reliably detect multiple colors on uneven surfaces, even in tight spaces.
January 31, 2013
Controls & Machine Components
TURCK, Inc: Splitters and tees for DeviceNet applications
TURCK introduces new 7/8-16UN minifast tees, splitters and in-line diagnostic devices, designed for use in DeviceNet applications, including CAN networks and mobile equipment.
January 31, 2013
Controls & Machine Components
GE Intelligent Platforms: Modules
COM Express modules deliver high performance and reliability in multi-display applications.
January 31, 2013
Home
Pepperl + Fuchs: Photoelectric sensors
Series 61 photoelectric sensors deliver flexible, powerful optical sensing performance economically, in a robust and industry-standard housing that promotes drop-in replacement without requiring redesign.
January 31, 2013
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