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OMAC to show Plug-and-Pack demo machine

Comprehensive, multi-vendor technology demonstrator scheduled for PACK EXPO 2004 completion

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The group behind the Plug-and-Pack™ “best practices” guidelines for applying packaging machine automation announced that it will demonstrate a flow wrapper that incorporates all of the group’s current guidelines. The machine will be shown at the 2004 PACK EXPO International show, November 7-11, 2004, in Chicago. This complete implementation will demonstrate the commercial and technical viability of the guidelines. The group, OMAC (Open Modular Architecture Controls) Plug-and-Pack Workgroup, hopes the demonstration will accelerate the introductions of conforming products and end user specifications.

The PackConnect team will demonstrate multi-vendor interoperability at the drive/controller interface based upon accepted IEC standards, and the ability to communicate with various devices through multiple device-level buses.

The PackSoft team will demonstrate a common look and feel, leading to general ease of translation of software across platforms based on IEC 61131-3 and PLCopen motion function blocks.

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