New Tool: ProSource
Checkout our packaging and processing solutions finder, ProSource.

Condition Monitoring Sensor

Balluff’s condition monitoring sensor can measure vibration, temperature, relative humidity, and ambient pressure. It collects and processes these readings and outputs digital statistical data to a host system via IO-Link.

Condition Monitoring Sensor

This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.

In addition, the sensor can detect and communicate its condition, continuously reporting its temperature, number of operating hours, and start cycles. By automating cost-intensive manual inspections, it minimizes unscheduled stops and faults in the production process. This condition data is an essential component for implementing smart and flexible manufacturing.

Balluff's sensor is available in two versions, both in an extremely small stainless-steel form factor. The first measures contact temperature and vibration in all three axes of motion and has  IP67 and IP69K ratings making it especially useful for harsh environments. The other adds the additional environmental variables of relative humidity and ambient pressure and delivers an IP67 rating. 

The sensor’s standardized IO-Link protocol allows users to easily parameterize the sensors and match the processing in the sensors to their specific application. The process data structure permits users to configure five measured or preprocessed data types to be cyclically transmitted. It is also possible to perform an acyclical request for additional statistical processing variables. 

Key features:
Multiple measurements in one device: vibration, temperature, relative humidity, ambient pressure

Integrated processing circuitry with configurable data preprocessing

Configurable events and status indicators

Fast connection and simple to incorporate using IO-Link

Extremely compact form factor for restricted spaces


Fill out the form below to request more information about Condition Monitoring Sensor
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
Read More
How Can You Honor a Leader?
Discover Our Content Hub
Access Packaging World's free educational content library!
Read More
Discover Our Content Hub