New Tool: ProSource
Checkout our packaging and processing solutions finder, ProSource.

Turck: I/O module

Turck introduces the FEN20-4IOL industrial Ethernet I/O module that uses I/O-Link to improve device configuration, monitoring, and replacement in industrial applications.

FEN20-4IOL
FEN20-4IOL

The compact block offers four I/O-Link channels. It is ideal for a wide range of industries, including manufacturing where space is at a premium, on robot end-effectors where small I/O is needed, and in automotive manufacturing and Tier 1 plants. In addition to the device functioning as an I/O-Link master, each of the I/O-Link (C/Q) pins can optionally be configured as digital input or output.

The FEN20-4IOL is also a Field Logic Controller (FLC). As an FLC, the module can carry out control tasks at the field level. This enables users to implement simpler applications without the need for an additional PLC. In more complex applications, the FLC function provides the processing requirement for the parent control system. Configuration and programming are carried out via Turck’s ARGEE web-based engineering system.

With multiprotocol plug-and-play functionality, the FEN20 devices are immediately ready for use in PROFINET®, Modbus® TCP or EtherNet/IP™ systems. The device detects the protocol used by listening to the communication traffic during the startup phase. The FEN20 device measures just 55x62.5x30 mm and carries an IP20 rating, and fits in small control boxes, control panels, or other existing housings.

The FEN20-4IOL is equipped with an integrated EtherNet switch and a built-in web server to display diagnostic information and provide access to device configuration parameters. The web page was created with a responsive design so that even a smartphone can be used for simple diagnostics.

Discover Our Content Hub
Access Packaging World's free educational content library!
Read More
Discover Our Content Hub
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
Read More
How Can You Honor a Leader?