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Hoffman: I/O enclosures

Hoffman (Anoka, MN) has added 10 new enclosure modules for I/O devices to its Inline® Instrumentation Enclosure Series. Full-length mounting brackets welded to the top and bottom of the enclosure provide flexible mounting.

Pw 16108 Hoff

The enclosures are available in 5 different widths and feature either solid or window doors.

Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
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Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Annual Outlook Report: Sustainability
The road ahead for CPGs in 2025 and beyond—Packaging World editors review key findings from a survey of 88 brand owners, CPG, and FMCG readers.
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Annual Outlook Report: Sustainability