Discover What’s Possible in Packaging & Processing, Oct. 18-21 in Chicago
See solutions from 2,600 exhibitors and gain insights from 150+ free educational sessions at North America’s largest packaging & processing event.
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F/f/s partnership for machines and materials

The Orics form/fill/seal system thermoforms APET material and is good for food, medical devices, hardware, electronics, or anything needing either a permanent or reclosable flexible film lidding. A partnership among Orics, lidstock provider Berry Plastics, and forming web supplier Klockner Pentaplast brings global advantages.

Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
REGISTER NOW & SAVE
Discover How to Stay Ahead of the Competition at PACK EXPO International
Is your packaging line built for connected packaging?
RFID, QR codes, and 2D barcodes are reshaping CPG operations. See how leading brands are adapting.
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Is your packaging line built for connected packaging?