Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Balluff: Ultrasonic sensors

Balluff’s family of ultrasonic sensors detect the presence of targets or measure the distance from selected objects when long sensing ranges and high accuracy are needed.

Pw 4574 Webballuff5
Based on the latest in acoustic wave technology, ultrasonic sensors see targets independent of color, transparency, surface texture or ambient conditions. They are reliable with a number of different target media, including solids, powders, or liquids. Suitable for dusty, humid, or hazy environments, sensors offer multiple sensing ranges (up to 6 m, 19.7 ft). Available in a variety of tubular and block style housings, sensors have a IP65 or IP67 protection rating. With discrete, analog or combination output configuration options, the family of ultrasonic sensors works with many controllers and have programmable setpoints and operating modes.
Fill out the form below to request more information about Balluff: Ultrasonic sensors
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
Read More
Check out new technology from 2,500+ packaging & processing suppliers
Special Report: Track & Trace
Discover new tools to approach the supply chain that allow you to leverage your data, see real-time visibility, and forecast future sales. You’ll also learn about KH Hive, an in-house digital demand planning tool that Kraft Heinz created to help the company realize its goals, forecasting sales expectation down to the SKU level, location level, and daily level.
Read More
Special Report: Track & Trace