Discover What’s Possible in Packaging & Processing, Oct. 18-21 in Chicago
See solutions from 2,600 exhibitors and gain insights from 150+ free educational sessions at North America’s largest packaging & processing event.
REGISTER NOW & SAVE

Large-format package accumulation technology goes bigger, faster

The latest generation in large format package accumulation technology, the DYNAC Model 6500 from Hartness, has inherently higher speed and larger product dimension capability.

Videos from ITW Hartness
Laner
Elevator
Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
REGISTER NOW & SAVE
Discover How to Stay Ahead of the Competition at PACK EXPO International
Is your packaging line built for connected packaging?
RFID, QR codes, and 2D barcodes are reshaping CPG operations. See how leading brands are adapting.
Read More
Is your packaging line built for connected packaging?