Video: Blister packaging system handles variety of applications
FROM PACK EXPO 2008: Koch KBS-PL blister packaging system thermoforms blister film, cuts in longitudinal and transversal direction without any waste.
Nov 12, 2008
Machinery Basics
Annual Outlook Report: Sustainability
The road ahead for CPGs in 2025 and beyond—<i>Packaging World</i> editors review key findings from a survey of 88 brand owners, CPG, and FMCG readers.
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Break out of the ordinary: see what’s new in packaging & processing!
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this September to experience a breakthrough in packaging and processing.
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