AMETEK MOCON, a global provider of package testing instruments, announced the launch of the Dansensor Lippke 5000, a new package integrity testing system. The new product can measure package leaks, burst pressure, and seal strength in all types of packages, with or without a modified atmosphere.
The design features the industry’s first test head with the sensor probe located inside the needle. The integrated design provides improved consistency and sensitivity for more accurate pressure control during the testing process so that leak, burst, and creep test results are as accurate as possible.
The new package testing system also features shorter fill times, an improved pre-fill process (which prevents over-shoot), and ultimately shorter test times.
The Dansensor Lippke 5000 was designed for users on the production floor or in the laboratory. It offers a new touchscreen with a simplified, user-friendly GUI (graphical user interface) that enables easy and intuitive data capturing, storage, and export.
For Production Quality Control, operators can easily set up data once and then simply transfer it from one instrument to another, making exact clones of the first units. Once operators have set up one instrument for their package types, they can copy the complete set-up, operator settings, and access levels to other instruments.
The new Dansensor Lippke 5000’s is unique in offering the accuracy afforded by having test head needles with a sense probe located inside the package.
Dansensor Lippke 5000 also supports numerous standard test methods including ASTM F-1140, ASTM F-2054, ASTM F-2095, ASTM F-2096, ISO 11607 and enables compliance to 21 CFR, part 11 for data security.
