See new packaging innovations in one convenient place at PACK EXPO East
Get up to speed on the latest innovations in packaging and processing at PACK EXPO East, March 18 – 20 in Philadelphia. Don’t miss out!

TURCK, Inc: Diagnostic power conditioner backplane provides advanced monitoring

Turck’s Diagnostic Power Conditioner (DPC) Backplane for FOUNDATION Fieldbus H1 segments provides up to four segments with redundant power and 800mA/segment.

Pw 52144 Default Dpc 49 4 Rmb Pr

The DPC backplane communicates diagnostic data back to an Asset Management System via high-speed Ethernet to alert operators of any communication challenges.

With Turck¹s high-speed Ethernet web-server, operators simply connect the DPC backplane to the field device and access live H1 diagnostic data from any LAN-based computer. Because Ethernet is used instead of a fieldbus communication to view diagnostic data, a significant amount of time is saved.

The DPC system features an integrated diagnostics module that provides users with vital statistics that help to diagnose any problems associated with the FOUNDATION fieldbus physical layer. The information provided by the DPC system assists in the commissioning and maintenance of a FOUNDATION fieldbus system.

 

Discover innovations from 400+ packaging & processing suppliers.
The largest PACK EXPO East in history is March 18-20 in Philadelphia! In one convenient location, you’ll discover new technology from top suppliers, get quality problem-solving time with experts and learn the latest trends in free educational sessions.
Read More
Discover innovations from 400+ packaging & processing suppliers.
Discover Our Content Hub
Access Packaging World's free educational content library!
Read More
Discover Our Content Hub