Attend PACK EXPO – this year’s can’t-miss event in Chicago, Oct 23-26.
Discover solutions from 2,000+ exhibitors to advance your operations and network with colleagues at PACK EXPO International.
REGISTER TODAY

U of I names pack expo scholarship winners

The University of Illinois at Urbana-Champaign (UIUC) named Christina Weeks, Yi Wang, Felicia de Santos, Bin Zhou, and Patricio R. Lozano as student recipients of its 2007 Pack Expo Scholarship funds.

UIUC was one of 19 schools with a packaging curriculum that received scholarship funds from the Packaging Machinery Manufacturers Institute’s (www.pmmi.org) Pack Expo Scholarship program. UIUC was awarded $9,500. Its packaging program started in 1992 and provides engineering and science students with the knowledge and scope to integrate advanced theoretical concepts and applied skills into packaging and its related disciplines.

Test Your Smarts
Take Packaging World's sustainability quiz to prove your knowledge!
Take Quiz
Test Your Smarts
The top conveying tips
Read best practices to ensure efficient product handling.
Download Today
The top conveying tips