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Configure more, program less

B&R's mapp Technology can cut programming time by two-thirds, while simplifying recipe changes, diagnostics, integration, and field modifications.

North American packaging machinery users and OEMs appreciate the clarity of familiar ladder logic programming. But as machine functionalities become more sophisticated, ladder programs can become too complicated, even when supplemented by function blocks. Because modular application (mapp) technology from B&R maintains familiar, IEC-compliant ladder and function block programming – except with mapp components – more time is spent on configuring rather than programming.

mapp technology also provides a fast, easy way to implement OMAC PackML, the ISA TR88.00.02 standard for defining machine states, modes and tag naming conventions. With mapp Technology, machine control can be accessed and diagnosed down to the function block level without requiring dedicated software, special training or access to the source code.

PACK EXPO attendees can see first-hand how mapp technology can cut programming time by two-thirds, while simplifying recipe changes, diagnostics, integration, and field modifications at the B&R booth. A B&R representative will also be present at the OMAC (Organization for Machine Automation and Control) booth #1241 in the Central hall from 9:00-10:00 a.m. on Wednesday, September 30 ready to discuss the capabilities of mapp PackML.

Visit B&R at booth #5956 in the South Hall at PACK EXPO.

Take the mapp technology video tour.

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Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
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Discover How to Stay Ahead of the Competition at PACK EXPO International