Discover What’s Possible in Packaging & Processing, Oct. 18-21 in Chicago
See solutions from 2,600 exhibitors and gain insights from 150+ free educational sessions at North America’s largest packaging & processing event.
REGISTER NOW & SAVE

Tamp system for RFID labels

PACK EXPO : TampTenna™ is a new system from Diagraph that writes to an RFID-tag-enabled pressure-sensitive label while the label is on the tamp pad.

Pw 12406 Diag

The same antenna that writes to the tag also verifies its readability. But verification takes place after the thermal-transfer-printed label has been applied.

This is an important difference compared to systems that verify a tag's readability before label application because with those systems, says Diagraph, if the chip in the pressure-sensitive label is damaged during passage through the peel plate or during tamp application, there is no verification station to detect the damage, so there's nothing to stop an unreadable chip from being tamped onto the corrugated shipper.

Diagraph also claims the system, which has a rated speed of 40 to 55 labels/min depending on label size, is faster than comparable ones. The TampTenna feature can also be retrofit to existing Diagraph PA/5000LT systems already in the field.

Retail multipack suppliers, all in one place
25+ vetted systems for cups, tubs, and bottles — shrink, paperboard, banding, clip, and more. Free download.
Read More
Retail multipack suppliers, all in one place
Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
REGISTER NOW & SAVE
Discover How to Stay Ahead of the Competition at PACK EXPO International