New Tool: ProSource
Check out our packaging and processing solutions finder, ProSource.

Packaging Summit conference to drill down on four packaging areas

Fourth annual trade show scheduled for May 13-15 in Rosemont, IL, with focuses from innovation to sustainability to contract packaging.

Pw 7176 Packaging Summit Logohi

Innovation, sustainability, global issues, and contract packaging will be the four conference focuses of this year’s fourth annual Packaging Summit Expo and Conference, sponsored by the Institute of Packaging Professionals (www.iopp.org). The trade show will be held May 13 to 15 at the Donald E. Stephens Convention Center, Rosemont, IL. Contract Packaging magazine, will moderate the panel.

Conference hours will be from 8 a.m. to 1:30 p.m. May 13 and 8 a.m. to noon May 14 and 15.

Innovation and sustainability are the two conference topics on May 13. On the innovation front, Brian Reilly, senior director of the Innovation Institute at Georgia-Pacific, will present "Life Cycle Analysis...Real-World Execution." A roundtable of panelists will function as a "think tank" on how to execute a packaging-innovation strategy.

Regarding sustainability, Susan Homan, marketing manager-sustainable materials, DuPont Packaging & Industrial Polymers, will present "Analyzing the Value Proposition...for sustainable materials."

On May 14, presentations will focus on thinking globally. Paul Lewellen Sr., director supplier development, Wal-Mart International Merchandising, will give an overview of "Wal-Mart’s Strategy...on global packaging reduction."

Issues related to outsourced packaging services will rule the day on May 15. A roundtable of panelists will explore strategies for optimizing contract packaging. Jim George, editor of

For a full conference agenda and other details on Packaging Summit, visit www.pkgsummit.com.

How AI is reshaping CPG manufacturing operations
Today’s CPG companies are faced with mounting challenges in their manufacturing operations. You have the data that could help you, but can you turn that data into knowledge? See how artificial intelligence can help. Learn what’s working for Pfizer, Post, and Smithfield.
Read More
How AI is reshaping CPG manufacturing operations
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
Read More
How Can You Honor a Leader?