New Tool: ProSource
Checkout our packaging and processing solutions finder, ProSource.

David Lewis Appointed Vice President of Packaging for Afflink, LLC

Lewis was appointed vice president of packaging following the promotion of former vice president, Michael Wilson, the company’s new president and CEO.

Dave Headshot

This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.

“Packaging continues to be a growth engine for us, and I am thrilled to pass the baton over to someone who not only understands independent distribution, but the Packaging channel specifically,” said Michael Wilson, Afflink’s president and CEO.

“Dave’s wealth of knowledge, expertise and industry connections will greatly contribute to the growth of our members and suppliers for years to come.”

With a career spanning over 20 years in the industry, Lewis’ background is built from numerous roles in the automation, corrugated, and protective categories of packaging, including his most previous role as President of SupplyOne’s Atlanta location.

His past industry experience also includes roles with other packaging and tape manufacturers such as Permacel and Unisource.

“After joining Afflink this year as a regional sales manager, I’m excited to serve the team as vice president of the packaging division,” said Lewis. 

“I look forward to supporting Afflink’s packaging members and our supplier partners by helping create business opportunities, not only for our company, but for the companies we bring together.”

Fill out the form below to request more information about David Lewis Appointed Vice President of Packaging for Afflink, LLC
How AI is reshaping CPG manufacturing operations
Today’s CPG companies are faced with mounting challenges in their manufacturing operations. You have the data that could help you, but can you turn that data into knowledge? See how artificial intelligence can help. Learn what’s working for Pfizer, Post, and Smithfield.
Read More
How AI is reshaping CPG manufacturing operations
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
Read More
How Can You Honor a Leader?