Attend PACK EXPO – this year’s can’t-miss event in Chicago, Oct 23-26.
Discover solutions from 2,000+ exhibitors to advance your operations and network with colleagues at PACK EXPO International.
Toshiba: Ultra-compact HD video camera
Toshiba America Information Systems, Inc.
Eriez: Electromagnetic conveyors for bulk materials
Texwrap: Entry-level shrink tunnel
LSI: Vial labeling system
Flexicon: Dust hood for bulk bag dischargers
Agr: Blowmolder control system manages crystallinity
Modular Packaging: Tablet counter powered by 3D camera technology
Mocon: Organism test improves food safety
Lantech: Film cable for pallets
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