New Tool: ProSource
Check out our packaging and processing solutions finder, ProSource.

Mechatronics, electronics main feature at event

Festo AG gathered an international contingent of editors to company headquarters in Esslingen-Berkheim near Stuttgart, Germany, on Oct. 22-13 for a briefing on the company's latest news.

Most of Festo's presentations discussed handling systems and assembly. The handling systems have applicability in packaging equipment, where moving and palletizing functions are important. New product entries such as the proportional piezo gripping tool that conserves space while saving energy were also introduced.

For more information on this tool, please read a related Packaging World article here.

How AI is reshaping CPG manufacturing operations
Today’s CPG companies are faced with mounting challenges in their manufacturing operations. You have the data that could help you, but can you turn that data into knowledge? See how artificial intelligence can help. Learn what’s working for Pfizer, Post, and Smithfield.
Read More
How AI is reshaping CPG manufacturing operations
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
Read More
How Can You Honor a Leader?