See new packaging innovations in one convenient place at PACK EXPO East
Get up to speed on the latest innovations in packaging and processing at PACK EXPO East, March 18 – 20 in Philadelphia. Don’t miss out!

Pepperl + Fuchs: Space-saving AS-interface power supplies

Pepperl+Fuchs’ VAN-115/230AC-K19 AS-Interface Class II Power Supplies are 90.5% efficient to minimize power loss, while also limiting the need for enclosure cooling.

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A compact 42mm wide design enables users to stack these AS-Interface power supplies side-by-side to reduce the size of their enclosure. The power supplies support input voltages from 85 to 264 VAC.  They deliver up to 2.8 A output, and a unique PowerBoost feature can deliver a temporary output power increase up to 3.2 A.  An LED display provides quick visual status indication.
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Discover innovations from 400+ packaging & processing suppliers.
The largest PACK EXPO East in history is March 18-20 in Philadelphia! In one convenient location, you’ll discover new technology from top suppliers, get quality problem-solving time with experts and learn the latest trends in free educational sessions.
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Discover innovations from 400+ packaging & processing suppliers.