Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Proximity sensor

Designed for packaging line and machine applications, the new Model SM600 Flat-profile Series ultrasonic proximity sensors from Hyde Park (Dayton, OH) detect objects as small as 0.06" at a distance of 1.5" at speeds of 2ꯠ/min.

Pw 22042 Desforpaclin 22
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
Read More
Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
Read More
New e-book on Multipacking and Case Packing