Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Proximity sensor

Designed for packaging line and machine applications, the new Model SM600 Flat-profile Series ultrasonic proximity sensors from Hyde Park (Dayton, OH) detect objects as small as 0.06" at a distance of 1.5" at speeds of 2ꯠ/min.

Pw 22042 Desforpaclin 22

Applications include detection of box sides and container edges, cap presence and/or tilt detection, fill-level check, fill-tube presence monitoring, downed container detection and case inspection.

Special Report: Track & Trace
Discover new tools to approach the supply chain that allow you to leverage your data, see real-time visibility, and forecast future sales. You’ll also learn about KH Hive, an in-house digital demand planning tool that Kraft Heinz created to help the company realize its goals, forecasting sales expectation down to the SKU level, location level, and daily level.
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Special Report: Track & Trace
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers