Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

Proximity sensor

Designed for packaging line and machine applications, the new Model SM600 Flat-profile Series ultrasonic proximity sensors from Hyde Park (Dayton, OH) detect objects as small as 0.06" at a distance of 1.5" at speeds of 2ꯠ/min.

Pw 22042 Desforpaclin 22

Applications include detection of box sides and container edges, cap presence and/or tilt detection, fill-level check, fill-tube presence monitoring, downed container detection and case inspection.

2024 PACK EXPO Innovations Reports
Exclusive access: Packaging World editor-curated reports revealing PACK EXPO's most groundbreaking technologies across food, healthcare, and machinery sectors. Each report features truly innovative solutions selected from hundreds of exhibitors by our expert team. Transform your operations with just one click.
Access Now
2024 PACK EXPO Innovations Reports
Coding, Marking, and Labeling Innovations Report
Explore our editor-curated report featuring cutting-edge coding, labeling, and RFID innovations from PACK EXPO 2024. Discover high-speed digital printing, sustainable label materials, automated labeling systems, and advanced traceability solutions that are transforming packaging operations across industries.
Access Report
Coding, Marking, and Labeling Innovations Report