See new packaging innovations in one convenient place at PACK EXPO East
Get up to speed on the latest innovations in packaging and processing at PACK EXPO East, March 18 – 20 in Philadelphia. Don’t miss out!

Balluff: Fiber-optic sensor

Balluff's (Florence, KY) BOS 20K fiber-optic sensor uses teach-in capability to eliminate adjustment hassles and offer accurate sensor set-up. The versatile sensor has a compact 60 x 30 x 13 mm housing and is suitable for small parts detection, part feature checks, counting, and part positioning.

Pw 21709 Bal Flo Kybos 22

Powered by 10-30VDC, the sensor is programmable for PNP or NPN operation. It's CE-rated and sealed to IP65.

Discover innovations from 400+ packaging & processing suppliers.
The largest PACK EXPO East in history is March 18-20 in Philadelphia! In one convenient location, you’ll discover new technology from top suppliers, get quality problem-solving time with experts and learn the latest trends in free educational sessions.
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Discover innovations from 400+ packaging & processing suppliers.
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