Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Omron Electronics LLC: Omron Electronics LLC: Communications driver supports Omron controllers

Red Lion’s new communications driver allows the company’s G3 Series HMIs, Data Station Plus and Modular Controller Series to monitor and control one or more Omron STI G9SP safety controllers.

Pw 1822 Webredlion
In addition, these Red Lion products add advanced protocol conversion, data logging, and web-based remote access to applications using Omron STI’s newest safety controller.   Crimson 3.0 is the complimentary and easy-to-use software platform for programming Red Lion products. The Omron STI G9SP driver is the latest addition to over 200 protocols that Crimson 3.0 currently supports.
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing