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Supplier news: Achievements

The Anderson School at UCLA (Los Angeles, CA), in conjunction with Hewlett-Packard Co. (Palo Alto, CA) has created the UCLA Award for Excellence in Supply Chain Management.

Coding, Marking, and Labeling Innovations Report
Explore our editor-curated report featuring cutting-edge coding, labeling, and RFID innovations from PACK EXPO 2024. Discover high-speed digital printing, sustainable label materials, automated labeling systems, and advanced traceability solutions that are transforming packaging operations across industries.
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Coding, Marking, and Labeling Innovations Report
Is your palletizing solution leaving money on the floor?
Discover which palletizing technology—robotic, conventional, or hybrid—will maximize your packaging line efficiency while minimizing long-term costs in this comprehensive analysis.
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Is your palletizing solution leaving money on the floor?