Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

Messe Dusseldorf and ESMA join to address printed electronics

The German trade fair organizer Messe Düsseldorf and ESNA (European Association for Specialist Printing Manufacturers of Screen, Digital and Flexo Technology) have formed a strategic cooperation in order to address the fast-growing printed electronics market and its huge potential in a wide range of sectors.

The new special show PEPSO (Printed Electronics Products and Solutions) will be organized at six of Messe Dusseldorf ' s relevant trade fairs, including interpack May 8-14 in 2014. In doing so, Messe Düsseldorf and ESNA will offer an information platform for the latest trends and developments relating to printed electronics in the glass and solar industry, the medical and retail technology sector, and the plastics, packaging, and printing industries.

“Printed Electronics is becoming attractive in many user sectors for which Messe Düsseldorf stages the respective flagship fairs. By establishing PEPSO, we are giving this topic a platform of its own and are integrating it in the trade fairs for the retail, glass processing, packaging, printing, and medical sectors. We are in the ideal position to offer manufacturers of printed electronics a marketing showcase for specific target groups,” stated Hans Werner Reinhard, Deputy Managing Director of Messe Düsseldorf.

“The printing industry is ready to vertically integrate functionality and electronic applications. This cooperation is an ideal opportunity for the printing sector to gain access to the many industries and markets covered by Messe Dusseldorf's range of world class exhibitions,” added Peter Buttiens, CEO of ESMA.

PEPSO special shows are planned at the following trade fairs: COMPAMED 2013, EuroShop 2014, EuroCIS 2014, glasstec 2014, interpack 2014, and drupa 2016. Detailed information about PEPSO is available at: www.pepso-global.com

The two partners will combine their public relations and online activities and promote each other’s events by presenting themselves at the appropriate partner events. Messe Düsseldorf will be represented with an information stand at the upcoming AFIP – Advanced Functional & Industrial Printing – in Düsseldorf on March 6 and 7, 2013 while ESMA will take part in the relevant Düsseldorf trade fairs.

 

Coding, Marking, and Labeling Innovations Report
Explore our editor-curated report featuring cutting-edge coding, labeling, and RFID innovations from PACK EXPO 2024. Discover high-speed digital printing, sustainable label materials, automated labeling systems, and advanced traceability solutions that are transforming packaging operations across industries.
Access Report
Coding, Marking, and Labeling Innovations Report
Pharmaceutical Innovations Report
Discover the latest breakthrough packaging technologies shaping the pharmaceutical sector. This report dives into cutting-edge innovations, from smart containers that enhance patient safety to eco-friendly materials poised to transform the industry’s sustainability practices. All from PACK EXPO. Learn how forward-thinking strategies are driving efficiency and redefining what’s possible in pharma packaging.
Learn More
Pharmaceutical Innovations Report