While the Committee will meet in person at SuperCorr, sponsored by the Technical Assn. of the Pulp & Paper Industry, in Atlanta on Tuesday, Nov. 9, individuals attending Pack Expo in Chicago have two ways to participate in the committee meeting.
For those in Chicago for Pack Expo a conference-call phone link can be established by calling 877/512-0941, using the last four digits, 0941, as the participant code. The meeting begins at 10 a.m. in Chicago. For those who wish to participate via a computer using a Virtual Classroom with visuals can link via this address. To enter the classroom, a participant may need the following key (UCG7J469L) to enter. It also may help, says committee chair Andy Kerr of Eastman Kodak to test this system by using the following link: hpe-learning.com/testsetup.
Among the topics for the discussion will be ECT and Mullen standards for corrugated board and how well they work for non-domestic markets. Participants will be asked if they use other ways to specify corrugated to converters outside the United States. In addition, the roundtable will explore the shift from palletized loads going to warehouses/stores compared to direct shipments to customers and what it means for packaging specs and for recovery of old corrugated containers, reports Andy Kerr of Eastman Kodak, chairman of the tappi End-User Committee.
