Technical Assn. of the Pulp & Paper Industry
More from Technical Assn. of the Pulp & Paper Industry
The medium is the message
The need to produce lower-weight, yet strong, corrugated board requires innovation up and down the value chain—innovation that has been lacking in North America.
Jul 2nd, 2008
A useful directory of packaging and related associations that will help in your journey to sustainable packaging.
Feb 4th, 2008
Breaking through performance thresholds
One perfect word summarizes the sustainable packaging movement:less.
Sep 5th, 2007
William Henderson, Automation and Motion Div., Siemens Energy & Automation, Inc., was elected to the executive board of the Open Modular Architecture Controls (OMAC) Packaging Workgroup.
Mar 31st, 2006
ISU gains big assists from industry
Indiana State University is tapping packaging resources through its new R&D Center.
Aug 31st, 2005
Grote Industries puts ISU to the test
The Indiana Packaging Research and Development Center, located on campus at Indiana State University in Terre Haute, IN, was formed in 2004.
Jun 30th, 2005
Sonoco creates economies of scale that accelerate speed-to-market and reduce obsolescence in helping manufacturers meet the emphasis on outsourced packaging that works at retail.
Mar 31st, 2005
TAPPI and Pack Expo to link
Some logistics changes are being planned for the link planned between attendees of Pack Expo International in Chicago and the End Users Committee meeting at SuperCorr, the corrugated packaging show.
Oct 31st, 2004
TAPPI end-user roundtable to link with Pack Expo
The End-User Committee of the Technical Assn. of the Paper and Pulp Industry will interface with corrugated paperboard people in Chicago for Pack Expo, Nov. 7 to 11, via a Virtual Classroom connection.
Sep 30th, 2004