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News from Tokyo Pack: Candy package debuts augmented reality technology
On display at the Dai Nippon Booth was a package of candy from the Fujiya Co. that takes advantage of augmented reality to engage consumers.
Oct 12, 2012
Machinery Basics
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
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