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White Paper |
February 8, 2013
Optimizing hot melt adhesive use in packaging operations
With the increasing prices and decreasing availability of hot melt adhesives, packagers can no longer just place a long bead of adhesive to ensure a strong seal or bond. Packagers must determine the exact amount of adhesive needed to produce a secure bond, then follow up by implementing dispensing technologies that will preserve the integrity of their process and bottom lines. Recent tests prove that the bond strength of short intermittent adhesive beads is equal to the bond strength of long, continuous beads.
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