- Contract Packaging
- Leaders in Packaging
- Calendar of Events
Alert: Packaging World now enhanced for the iPad and iPhone. Watch a quick video preview
Article | August 22, 2013
News from Purdue U. Calumet
Niaz Latif, Professor and Dean of the College of Technology at Purdue University Calumet, has announced that enrollment in the Mechatronics program has increased from 22 in the Fall of 2012 to 50 in the Fall of 2013.
Other news from Purdue University Calumet:
· The school’s BS in Mechatronics Engineering Technology Program has received the full accreditation by ABET (Accreditation Board for Engineering and Technology)
· The name “School of Technology” has been change to “College of Technology”
· In partnership with Sinclair Community College (OH) and Ivy Tech Community College (IN), Purdue University Calumet has received another NSF-ATE grant for a project called “Leadership Capacity Building for Manufacturing and Manufacturing Related Programs.”
Latif emphasizes that such developments would not have been possible without the ongoing support of the greater packaging community.
E-BOOK SPECIAL REPORT
42 Best Package Designs
Sign up to receive timely updates from our editors and download this e-book consisting of our editors' picks of most notable package designs. Updated for 2014!