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Intelligent packaging congress announced

A congress on active and intelligent packaging has attracted international speakers from many of the companies developing the latest technologies for active and intelligent packaging solutions.
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This congress of the Active & Intelligent Packaging Industry Association (AIPIA) is taking place in Tokyo, Japan, during the Tokyo Pack international packaging exhibition (2-5 October 2012). Experts will cover topics that include printed electronics for sensor tags, shelf life extension, the role of NFC in RFID development and an overview of how new packaging technologies will affect the entire supply chain. In addition, an introduction to Japanese and Asian packaging markets will point up differences in comparison to the West and how local legislation is affecting smart packaging developments there.

AIPIA Director Eef de Ferrante commented, “Never before have so many speakers covering the innovations across A&IP been assembled in one place. Anyone seriously interested in investing in these technologies, either as a user or producer, should be making certain they come to Tokyo for this event.

“Since we announced the programme there has been a strong increase in membership applications, include international blue chip companies including Sanofi, Johnson Mathey and The Coca-Cola Company. We are fast approaching 200 members, which confirms the importance of these technologies to the future of packaging,” he added.

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