A recent meeting of the OMAC Packaging Working Group’s PackML and PackSpec committees concentrated on clarifying and simplifying its standard to bolster increased acceptance and use of the standard by OEMs and end users.
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Packaging World and TricorBraun will donate a $2500 tuition scholarship to Missouri University of Science and Technology; The “Future Leaders in Packaging” scholarship is an annual award that is part of Summit Media Group’s Leadership in Packaging program.
Pack Expo International 2012 will be the site for judging the World Packaging Organization's (WPO) 2012 WorldStar Student Awards, an international packaging design competition; WPO will conduct the judging on Tuesday, Oct. 30.