Packaging World and TricorBraun will donate a $2500 tuition scholarship to Missouri University of Science and Technology; The “Future Leaders in Packaging” scholarship is an annual award that is part of Summit Media Group’s Leadership in Packaging program.
E-BOOK SPECIAL REPORT
42 Best Package Designs
Sign up to receive timely updates from our editors and download this e-book consisting of our editors' picks of most notable package designs. Updated for 2014!
Pack Expo International 2012 will be the site for judging the World Packaging Organization's (WPO) 2012 WorldStar Student Awards, an international packaging design competition; WPO will conduct the judging on Tuesday, Oct. 30.
As a result of an exclusive cooperation agreement signed between the Tokyo Pack Secretariat of Japan Packaging Institute (JPI) and the International Packaging Press Organization (IPPO), a Press Mission consisting of 13 professional packaging editors and journalists from nine countries will be attending Tokyo Pack 2012 to report on this exhibition, the largest and most significant packaging exhibition in Asia (2 – 5 October 2012, Tokyo Big Sight).